CFP-1287
Modern electric and off-road vehicles increasingly adopt 800 VDC battery systems to enable faster charging and reduce current levels. However, this higher system voltage introduces significant challenges related to creepage and clearance distances, electrical isolation, and thermal management. The fundamental question addressed in this work is how to achieve a compact yet safe and thermally […]
CFP-1286
This work addresses the reliability and efficiency limits of OBCs in battery electric vehicles that arise from the use of large electrolytic capacitor banks in the DC-Link. Most practical systems adopt a two-stage architecture in which an AC–DC PFC stage is followed by an isolated DC–DC converter, with the stages coupled by an energy buffer. […]
CFP-1285
The automotive industry is undergoing an unprecedented transformation, driven by disruptive technologies, intensified global competition – particularly from emerging Chinese OEMs – stagnating consumer demand, and mounting geopolitical uncertainties. To navigate this storm, OEMs and suppliers must aggressively reduce costs, compress development cycles, and deliver affordable yet high-quality products. This paper examines the implications of […]
CFP-1284
Abstract The paradigm shift towards electric mobility has intensified the demand for On-Board Chargers (OBCs) that embody the core automotive virtues of high power density, compact size, lightweight construction, and maintenance-free operation. In this context, single-stage power conversion topologies have emerged as a critical enabler, eliminating the bulky and reliability-limited intermediate DC-link capacitor that characterizes […]
CFP-1283
In this paper, the process development and reliability of novel copper preforms are presented, which while offering a substantially reduced manufacturing footprint, ensure enhanced reliability, high thermal conductivity, excellent thermo-mechanical fatigue resistance and most importantly, the capability to realise a single material system for top side of the die, die-attach and the substrate attach while […]
