High power applications like DCDC converter for battery electric vehicles face various challenges on system level, like increased power density, increased level of integration, higher switching frequency and increased efficiency.
All these technical key parameters are worthless if costs and manufacturability of these systems are not considered in the same manner. Especially the power semiconductors and the passive components are the main cost drivers in the system which also influence each other on technical and cost side.
This behavior leads to very specific requirements for the power semiconductors and packaging of those. By selecting a multi-chip arrangement, in a molded module, a very efficient and cost-effective solution can be implemented compared to a discrete setup.
This paper discusses results of different solutions and shows the capabilities and opportunities offered by CIPOS™ Prime molded module family. The application used for this comparison is a compact AC/DC converter, for powers up to 22kW, which was developed in-house for benchmarking different power semiconductors available on the market.