An innovative DC-link capacitor solution for the main xEV powertrain Inverter has been presented to the market as of July 2024. The innovation is sustained by the conjunction of four pillars: modularity and scalability; design for application; design for manufacturing; and standardization (catalog product). After a brief review of these pillars, this paper focuses on the practical study of xEVCap at the system level. The analysis is deployed in four major subject areas. The parasitics (ESL, ESR, …) from the single capacitor element to the effective ones at the system level. The second area is the as-sembly and joint technologies with the busbar. The third area is the strategy for thermal decoupling be-tween the capacitor and power semiconductors without a cooler. Everything is supported by Ansys and CFD simulations and with the construction of a demonstrator for laboratory testing and the thermal model of the demonstrator. Results are used to develop the algorithm incorporated by CLARA Web application to simulate Capacitor Banks. In addition, the mechanical characteristics of a new system using xEVCap are studied in detail: xEVCap, Busbar, fixations, gap fillers, adhesives, and how these different components of the system perform under thermo-mechanical stress. For that purpose, a new demonstrator is built and submitted to a set of testing to prove that xEVCap can be, not only electrically but also mechanically feasible for e-mobility systems.